Lam Research Corporation
Price History
Company Overview
Business Model: Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. The Company's core competency lies in nanoscale manufacturing enablement, chemistry, plasma and fluidics, and advanced systems engineering. Its products and services are designed to help customers build smaller and better-performing devices used in electronic products such as mobile phones, personal computers, cloud and enterprise servers, wearables, automotive vehicles, and data storage devices. The customer base includes leading semiconductor memory, foundry, and integrated device manufacturers that produce non-volatile memory, dynamic random-access memory, and logic devices. The Customer Support Business Group provides products and services, including customer service, spares, upgrades, and new and refurbished non-leading edge products, to maximize installed equipment performance and operational efficiency.
Market Position: Lam Research Corporation maintains a strong global presence with leadership and expertise in deposition, etch, and clean markets, facilitating significant innovations in semiconductor device manufacturing. The Company's sustainable differentiation is driven by its focus on research and development, leveraging cycles of learning from its broad installed base, collaborative efforts with semi-ecosystem partners, ability to identify and invest in a broad product portfolio to meet technology inflections, and focus on delivering multi-product solutions.
Recent Strategic Developments:
- Research and Development: Continued significant investments in R&D focused on leading-edge deposition, etch, clean, and other semiconductor manufacturing processes, with ongoing programs in sustaining engineering, product and process development, and concept and feasibility.
- Restructuring Plan: Initiated a restructuring plan in fiscal year 2023, substantially completed by June 30, 2024, which included a workforce reduction of approximately 1,760 employees and a strategic decision to relocate certain manufacturing activities to pre-existing facilities.
- ESG Commitments: Committed to achieving net zero emissions by 2050, with interim targets related to environmental impact. No material impacts to capital expenditures or results of operations associated with this goal as of June 29, 2025.
Geographic Footprint: Lam Research Corporation maintains a network of facilities throughout Asia, Europe, and the United States. Primary operational regions for manufacturing and R&D facilities include Fremont and Livermore, California; Tualatin, Oregon; Yongin, Gyeonggi Province, Korea; Bengaluru, India; Salzburg, Austria; and Villach, Austria. Manufacturing and warehouse facilities are also located in Ohio, Malaysia, and Taiwan. The Company's sales and service network extends across the United States, China, Europe, India, Japan, Korea, Southeast Asia, and Taiwan.
Financial Performance
Revenue Analysis
| Metric | Current Year (FY25) | Prior Year (FY24) | Change (FY25 vs FY24) |
|---|---|---|---|
| Total Revenue | $18,435,591 thousand | $14,905,386 thousand | +23.7% |
| Gross Profit | $8,979,059 thousand | $7,052,791 thousand | +27.3% |
| Operating Income | $5,900,968 thousand | $4,263,913 thousand | +38.4% |
| Net Income | $5,358,217 thousand | $3,827,772 thousand | +40.0% |
Profitability Metrics (FY25):
- Gross Margin: 48.7%
- Operating Margin: 32.0%
- Net Margin: 29.1%
Investment in Growth (FY25):
- R&D Expenditure: $2,096,387 thousand (11.4% of revenue)
- Capital Expenditures: $759,186 thousand
- Strategic Investments: Significant R&D investments focused on leading-edge deposition, etch, clean, and other semiconductor manufacturing processes. The Company also reviews acquisition prospects to complement existing products, augment market coverage, and enhance technological capabilities.
Business Segment Analysis
Wafer Processing Semiconductor Manufacturing Equipment & Services
Lam Research Corporation operates in one reportable business segment: manufacturing and servicing of wafer processing semiconductor manufacturing equipment. The Company's material operating segments qualify for aggregation due to similarities in economic characteristics, nature of products and services, and processes for procurement, manufacturing, and distribution.
Financial Performance:
- Revenue: $18,435,591 thousand (+23.7% YoY)
- Operating Margin: 32.0%
- Key Growth Drivers: Increased equipment spending by customers across Memory and Foundry market segments, coupled with increased customer support-related revenue from upgrades, spares, and services. Long-term growth is anticipated from secular demand for semiconductors and technology inflections, including 3D device scaling, multiple patterning, process flow, and advanced packaging chip integration, which are expected to increase the served available market for the Company's products and services.
Product Portfolio:
- Deposition Products: SABRE family (Electrochemical Deposition for copper and other metals, TSV, WLP, HBM), ALTUS family (Chemical Vapor Deposition and Atomic Layer Deposition for tungsten and molybdenum metallization), VECTOR family (Plasma-enhanced CVD for dielectric films), Striker family (ALD for thin, highly conformal dielectric films), SPEED family (High-Density Plasma CVD for dielectric gapfill).
- Etch Products: Kiyo family (Reactive Ion Etch for conductor etch), Flex family (Reactive Ion Etch for dielectric etch), Vantex family (Dielectric etch for high aspect ratio features in 3D NAND), Syndion family (Deep Reactive Ion Etch for deep silicon etch, TSVs), Versys Metal family (Metal etch for wiring and electrical connections).
- Clean Products: Coronus family (Dry Plasma Clean for bevel cleaning), DV-Prime, Da Vinci, EOS, and SP Series (Wet Clean for wafer cleaning and etch applications, WLP, IoT).
Market Dynamics:
- Competitive positioning within segment: The Company maintains leadership and expertise in deposition, etch, and clean markets.
- Key customer types and market trends: Customers include leading semiconductor memory, foundry, and integrated device manufacturers. Demand from cloud computing, artificial intelligence, 5G, and the Internet of Things is driving the need for increasingly powerful and cost-efficient semiconductors. Technical challenges with traditional two-dimensional scaling are driving inflections towards vertical scaling strategies like three-dimensional architecture and multiple patterning.
Sub-segment Breakdown:
- Systems Revenue: $11,491,280 thousand (FY25)
- Customer Support-Related Revenue and Other: $6,944,311 thousand (FY25)
- Revenue by Primary Market (FY25):
- Foundry: 45%
- Memory: 42%
- Logic/integrated device manufacturing: 13%
Capital Allocation Strategy
Shareholder Returns:
- Share Repurchases: $3,422,321 thousand in fiscal year 2025, including net share settlement of employee stock-based compensation. A total of 40,499 thousand shares were repurchased in fiscal year 2025.
- Dividend Payments: $1,149,542 thousand in fiscal year 2025. The quarterly dividend declared was $0.23 per share in fiscal year 2025.
- Future Capital Return Commitments: In May 2024, the Board of Directors authorized an additional $10.0 billion for Common Stock repurchases, supplementing prior authorizations. The remaining amount available under the repurchase program as of June 29, 2025, was $7,517,184 thousand. The Company also entered into accelerated share repurchase agreements totaling $500 million in April 2025.
Balance Sheet Position (as of June 29, 2025):
- Cash and Equivalents: $6,390,659 thousand
- Total Debt: $4,469,364 thousand (carrying value)
- Net Cash Position: $1,921,295 thousand
- Debt Maturity Profile:
- 2026: $750,000 thousand (principal)
- 2027: $0 thousand (principal)
- 2028: $0 thousand (principal)
- 2029: $1,000,000 thousand (principal)
- 2030: $750,000 thousand (principal)
- Thereafter: $2,000,000 thousand (principal)
Cash Flow Generation (FY25):
- Operating Cash Flow: $6,173,264 thousand
- Free Cash Flow: $5,414,078 thousand (Operating Cash Flow - Capital Expenditures)
Operational Excellence
Production & Service Model: The Company's manufacturing operations primarily involve assembling and testing components, sub-assemblies, and modules in cleanroom environments, which are then integrated into finished systems for shipment to or at customer locations. The Customer Support Business Group provides a broad range of services throughout the equipment lifecycle, including customer service, spares, upgrades, and new and refurbished non-leading edge products, to maximize installed equipment performance and operational efficiency.
Supply Chain Architecture:
- Key Suppliers & Partners: Lam Research Corporation outsources certain manufacturing, production warehousing, and logistics functions to third parties. Certain components and sub-assemblies are obtained from single or limited suppliers, with ongoing efforts to qualify alternative sources.
- [Supplier Category]: Third-party providers - [role and importance] Outsourced manufacturing, production warehousing, and logistics functions.
- [Technology Partners]: Semi-ecosystem partners - [strategic collaboration details] Collaborative focus with semi-ecosystem partners, including joint development and collaboration relationships with customers and suppliers.
Facility Network:
- Manufacturing: Facilities are located in California, Ohio, Oregon, Austria, Korea, Malaysia, and Taiwan.
- Research & Development: R&D facilities are located in Fremont and Livermore, California; Tualatin, Oregon; Yongin, Gyeonggi Province, Korea; Bengaluru, India; Salzburg, Austria; and Villach, Austria.
- Distribution: Production warehousing and logistics functions are outsourced to third parties.
Operational Metrics: Gross margin improvements in fiscal year 2025 were largely due to improved factory efficiencies.
Market Access & Customer Relationships
Go-to-Market Strategy:
- Direct Sales: The Company employs a team of product marketing and sales professionals, along with equipment and process engineers, who work directly with individual customers to develop tailored solutions for their wafer processing needs.
- Channel Partners: The Company emphasizes a collaborative focus with semi-ecosystem partners.
Customer Portfolio:
- Enterprise Customers: The customer base includes leading semiconductor memory, foundry, and integrated device manufacturers.
- Strategic Partnerships: The Company engages in joint development and collaboration relationships with customers, suppliers, and other industry members.
- Customer Concentration: In fiscal year 2025, two customers accounted for approximately 17% and 15% of total revenues, respectively. As of June 29, 2025, three customers accounted for approximately 19%, 15%, and 12% of accounts receivable, respectively.
Geographic Revenue Distribution (FY25):
- China: 34% of total revenue
- Korea: 22% of total revenue
- Taiwan: 19% of total revenue
- Japan: 10% of total revenue
- United States: 7% of total revenue
- Southeast Asia: 5% of total revenue
- Europe: 3% of total revenue
Competitive Intelligence
Market Structure & Dynamics
Industry Characteristics: The semiconductor capital equipment industry is characterized by rapid technological change, product innovation, and intense global competition. It is cyclical, experiencing periods of rapid growth and decline. Demand is driven by end markets such as cloud computing, artificial intelligence, 5G, and the Internet of Things, which require increasingly powerful and cost-efficient semiconductors. The industry faces growing technical challenges with traditional two-dimensional scaling, leading to significant inflections in manufacturing, such as the increasing importance of vertical scaling (3D architecture) and multiple patterning.
Competitive Positioning Matrix:
| Competitive Factor | Company Position | Key Differentiators |
|---|---|---|
| Technology Leadership | Strong | Leadership and expertise in deposition, etch, and clean markets; focus on R&D; ability to identify and invest in product portfolio breadth to meet technology inflections; core competency in integrating hardware, process, materials, software, and process control. |
| Market Share | Competitive | Aims to defend and gain market share through product enhancements and new product introductions. |
| Cost Position | Competitive | Offers upgrades for existing equipment as a cost-effective strategy; provides cost-efficient, production-proven wet clean and silicon wet etch solutions. |
| Customer Relationships | Strong | Focus on building long-term relationships; close-to-customer focus; comprehensive support programs and close working relationships with customers. |
Direct Competitors
Primary Competitors:
- Applied Materials, Inc.: Primary competitor in dielectric and metals deposition, and etch markets.
- Hitachi, Ltd.: Primary competitor in the etch market.
- Tokyo Electron, Ltd.: Primary competitor in the etch and wet clean markets.
- ASM International: Competitor in ALD and PECVD.
- Wonik IPS: Competitor in ALD and PECVD.
- Screen Holding Co., Ltd.: Primary competitor in the wet clean market.
- Semes Co., Ltd.: Primary competitor in the wet clean market.
Emerging Competitive Threats: The Company faces competition from new, regional competitors, including those created and financially backed by foreign governments. These competitors may operate in more favorable legal or regulatory environments, potentially gaining advantages from export control restrictions imposed on U.S. suppliers, particularly concerning sales to customers in China.
Competitive Response Strategy: Lam Research Corporation invests significant financial resources to strengthen and enhance its product and services portfolio and maintain global customer service and support. The Company's strategy includes timely manufacturing and shipment of products, maintaining existing products, and introducing product enhancements and new products that meet customer requirements.
Risk Assessment Framework
Strategic & Market Risks
Market Dynamics: The semiconductor capital equipment industry is subject to rapid changes in demand and is highly dependent on global economic conditions, electronics demand, industry supply and demand, and semiconductor prices. Variability in customer business plans can significantly impact demand for the Company's equipment and services. Technology Disruption: The Company's success depends on continuous and timely development of new products and enhancements. Rapid technological changes in semiconductor manufacturing, including the potential limits of traditional two-dimensional scaling and the emergence of new tools like machine learning and artificial intelligence, pose risks if the Company fails to develop and offer the correct technology solutions in a timely manner, or if new technologies render current offerings obsolete. Customer Concentration: Sales to a limited number of large customers constitute a significant portion of overall shipments, revenue, cash flows, and profitability, creating variability and potential negotiation pressures that could decrease pricing or margins.
Operational & Execution Risks
Supply Chain Vulnerabilities: The Company's business relies on the timely supply of parts, materials, and services from direct and indirect suppliers. Disruptions due to financial setbacks of suppliers, force majeure events, import/export approval difficulties, transportation interruptions, or shortages of components (including those affected by export restrictions or PFAS regulations) could impact the ability to meet demand, increase costs, and adversely affect revenue and operating results. Geographic Concentration: Manufacturing and R&D facilities are concentrated in a limited number of locations, making them susceptible to disruptions from natural disasters, widespread illness, geopolitical events, or IT failures, which could delay product development, shipments, or customer support. Capacity Constraints: During periods of rapid growth or decline, the Company may face challenges in scaling operations, potentially leading to a lack of infrastructure to meet customer expectations or excess fixed costs if capacity expands too rapidly.
Financial & Regulatory Risks
Market & Financial Risks: The semiconductor industry's cyclicality and dependence on global economic conditions can lead to fluctuating investment levels by manufacturers, impacting revenues and operating results. The Company is exposed to foreign currency exchange rate fluctuations, particularly for revenues in Japanese yen and expenses in euro, Korean won, Malaysian ringgit, and Indian rupee, despite hedging activities. Credit & Liquidity: The Company is exposed to the risk of default by or failure of counterparty financial institutions on derivative instruments and cash deposits. Leverage and debt service obligations may affect financial condition and ability to obtain additional financing. Regulatory & Compliance Risks: The Company is subject to a variety of governmental regulations across multiple jurisdictions (e.g., export controls, financial disclosures, corporate governance, privacy, anti-corruption, environmental, tax, tariffs, labor, carbon emissions). Non-compliance can result in fines, restrictions, reputational damage, and increased costs. Export Controls: U.S. government export controls, particularly those restricting sales to customers in China, have impacted and are likely to materially and adversely affect the Company's sales and competitive position, potentially strengthening international competitors not subject to such restrictions.
Geopolitical & External Risks
Geopolitical Exposure: Non-U.S. sales accounted for approximately 93% of total revenue in fiscal year 2025. Complex relationships among major trading nations can lead to trade disputes, impacts, and disruptions, particularly affecting the semiconductor industry in regions like China, Japan, Korea, and Taiwan. Trade Relations: Tariffs, export controls, trade barriers, sanctions, and changes in trade agreements can increase manufacturing costs, decrease margins, reduce product competitiveness, disrupt the supply chain, or inhibit the ability to sell products or provide services. Sanctions & Export Controls: New U.S. government controls, including expanded export license requirements and restrictions on sales to certain Chinese entities, have limited the market for products and increased exposure to foreign competition. Further controls or retaliatory actions by foreign governments could adversely impact future revenue and profits.
Innovation & Technology Leadership
Research & Development Focus: Core Technology Areas: Lam Research Corporation focuses its R&D on nanoscale manufacturing enablement, chemistry, plasma and fluidics, and advanced systems engineering. Key technology areas include deposition, etch, and clean processes, with a strategic emphasis on vertical scaling strategies like three-dimensional architecture and multiple patterning to enable device shrinks. Innovation Pipeline: The Company has several ongoing R&D programs dedicated to sustaining engineering, product and process development, and concept and feasibility studies, aimed at identifying and investing in a broad product portfolio to meet technology inflections.
Intellectual Property Portfolio:
- Patent Strategy: The Company's policy is to seek patents on inventions related to new or enhanced products and processes developed through its R&D, engineering, manufacturing, and support activities. It holds numerous U.S. and foreign patents and applications covering various aspects of its products and processes, with durations ranging from approximately one to twenty years.
- IP Litigation: Third parties may assert infringement, misappropriation, or other intellectual property claims against the Company.
Technology Partnerships: The Company maintains a collaborative focus with semi-ecosystem partners, including close-to-customer relationships and joint development and collaboration relationships with customers, suppliers, and other industry members.
Leadership & Governance
Executive Leadership Team (as of August 7, 2025)
| Position | Executive | Tenure | Prior Experience |
|---|---|---|---|
| President, Chief Executive Officer | Timothy M. Archer | 7 years | President and Chief Operating Officer at Lam Research Corporation; Chief Operating Officer at Novellus Systems, Inc. |
| Executive Vice President, Chief Financial Officer | Douglas R. Bettinger | 12 years | Senior Vice President and Chief Financial Officer of Avago Technologies; Vice President of Finance and Corporate Controller at Xilinx, Inc. |
| Executive Vice President, Chief Operating Officer | Patrick J. Lord | 13 years | Executive Vice President of CSBG and Global Operations at Lam Research Corporation; Senior Vice President and General Manager of DGSI Business Units at Novellus Systems, Inc. |
| Senior Vice President, Global Customer Operations | Neil J. Fernandes | 13 years | Group Vice President of Business Development and Sales Operations at Lam Research Corporation; Vice President of Sales Operations at Novellus Systems, Inc. |
| Senior Vice President, Chief Legal Officer and Secretary | Ava A. Harter | 1 year | Executive Vice President and Chief Legal Officer at Whirlpool Corporation; Senior Vice President, General Counsel, and Corporate Secretary at Owens Corning |
| Senior Vice President, Chief Technology and Sustainability Officer | Vahid Vahedi | 30 years | Senior Vice President and Chief Technology Officer at Lam Research Corporation; Senior Vice President and General Manager of the Etch business unit at Lam Research Corporation |
| Senior Vice President, Global Products Group | Seshasayee (Sesha) Varadarajan | 26 years | Senior Vice President and General Manager of the Deposition Business Unit at Lam Research Corporation; Senior Vice President and General Manager of PECVD and Electrofill Business Units at Novellus Systems, Inc. |
Board Composition: The Board of Directors is responsible for overseeing the Company's strategy and approach to addressing information security risks, including managing and assessing risks from cybersecurity threats, both directly and through the audit committee. The audit committee reviews and monitors the Company’s cybersecurity and information security policies and internal controls.
Human Capital Strategy
Workforce Composition (as of August 7, 2025):
- Total Employees: Approximately 19,000 regular full-time employees.
- Geographic Distribution: 43% in the United States, 50% in Asia, and 7% in Europe.
- Skill Mix: Over 29% of employees are engaged in research and development.
Talent Management:
- Acquisition & Retention: Recruitment efforts include partnerships with key universities, an internship program, campus events, and thesis awards and scholarships. The Company supports continuous skill building, development, and career opportunities through mentorship, coaching, professional development programs, and a self-directed online learning platform.
- Employee Value Proposition: A comprehensive compensation and benefits package is offered, including competitive 401(k) benefits, an employee stock purchase plan, tuition reimbursement, annual cash bonuses, and stock awards for executives and select employees. Paid holidays, time off, and parental leave benefits are also provided.
Diversity & Development:
- Development Programs: Leadership development programs are designed to scale leadership across the business, empowering leaders to motivate, inspire, and lead employees through change.
- Culture & Engagement: Employee engagement and voice are critical to the Company's culture, with input gathered through global surveys, in-person and online forums, and various employee programs.
Employee Health and Safety: The Company prioritizes employee health, safety, and well-being through investments in education, awareness, monitoring, and prevention programs. Environmental Health and Safety (EHS) policies, programs, and response plans are applied globally, with biannual formal safety leadership training for people managers in field support, manufacturing, R&D, warehouse, and logistics operations. Contractor safety performance is screened, and compliance with specified safety standards is required. Safety performance is monitored at enterprise, regional, and site levels using a global incident tracking system, and the Company maintains multi-site certifications for ISO 45001.
Environmental & Social Impact
Environmental Commitments: Climate Strategy: Lam Research Corporation strives to incorporate environmental, social, and governance (ESG) considerations into its operations, workplace practices, material sourcing, and product design. A key environmental goal is to achieve net zero emissions by 2050, supported by interim targets related to environmental impact. As of June 29, 2025, there have been no material impacts to capital expenditures or results of operations, and no material cash commitments associated with this goal.
Business Cyclicality & Seasonality
Demand Patterns: The semiconductor industry is cyclical, historically experiencing periodic downturns and upturns. Demand for the Company's equipment varies significantly based on economic conditions, supply, demand, and prices for semiconductors, and customer capacity requirements. The semiconductor capital equipment market is characterized by rapid changes in demand. Industry Cycles: The Company's business is significantly dependent on the overall world economic conditions and the capital equipment expenditures of semiconductor manufacturers, which are influenced by the market demand for integrated circuits. Planning & Forecasting: Management continuously reassesses strategic resource allocation choices in response to the changing business environment and attempts to respond to demand fluctuations with cost management programs.
Regulatory Environment & Compliance
Regulatory Framework: Industry-Specific Regulations: As a public company with global operations, Lam Research Corporation is subject to a variety of domestic and international governmental regulations across multiple jurisdictions. These include regulations related to export controls, financial and other disclosures, corporate governance, anti-trust, intellectual property, privacy (e.g., General Data Protection Regulation), anti-bribery, anti-corruption, anti-boycott, tax, tariffs, labor, health and safety, conflict minerals, human trafficking, hazardous materials management, and carbon emissions (e.g., California climate-related disclosures). International Compliance: Compliance with U.S. and international laws and regulations affecting foreign operations, including trade restrictions and sanctions, is a significant focus.
Trade & Export Controls: The U.S. Government has enacted export controls regulating the sales of certain technologies to customers in China, including expanded export license requirements and restrictions on sales to specific Chinese entities. These actions have limited the market for the Company's products and increased exposure to foreign competition. Tariffs, trade barriers, sanctions, and changes in trade agreements can increase manufacturing costs, decrease margins, and disrupt supply chain operations.
Legal Proceedings: The Company is not currently a party to any legal proceedings that it believes are material. It accrues for liabilities when it is probable that a liability has been incurred and the amount can be reasonably estimated. Based on current information, the Company does not believe a material loss from known matters is probable and has not recorded a material accrual for litigation or other contingencies.
Tax Strategy & Considerations
Tax Profile:
- Effective Tax Rate: 10.1% in fiscal year 2025.
- Geographic Tax Planning: The effective tax rate is highly dependent on the geographic composition of worldwide earnings and tax regulations in each region. International pre-tax income is taxable in the United States at a lower effective tax rate than the federal statutory rate. The Company benefits from a 15-year tax incentive ruling in Malaysia for one of its foreign subsidiaries, which decreased worldwide taxes by approximately $584.8 million in fiscal year 2025.
- Tax Reform Impact: The One Big Beautiful Bill Act ("OBBBA"), signed into U.S. law on July 4, 2025, introduces changes to U.S. taxation, including non-U.S. income, and the Company is currently assessing its potential implications for fiscal year 2026. Recommendations from the Organization for Economic Co-operation and Development’s Base Erosion and Profit Shifting 2.0 ("BEPS 2.0") project also have the potential to lead to changes in tax laws in numerous countries, including the implementation of a global minimum tax, which could materially impact the effective tax rate.
Insurance & Risk Transfer
Risk Management Framework: The Company utilizes insurance contracts to limit its exposure to certain indemnifications, although such coverage may not cover the full amount of all losses or may be subject to exclusions and deductibles. Risk Transfer Mechanisms: The Company employs hedging strategies, including foreign currency forward and option contracts, and interest rate swap arrangements, to mitigate market risks associated with interest rate and foreign currency exchange rate fluctuations. Indemnification agreements are also in place with directors, officers, and certain employees.